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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Toggle Bit | NO |
| Data Polling | NO |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| ECCN Code | EAR99 |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Command User Interface | YES |
| Ready/Busy | YES |
| Common Flash Interface | YES |
| Packaging | Tray |
| Operating Temperature | -40°C~85°C |
| Pbfree Code | no |
| Factory Lead Time | 10 Weeks |
| JESD-609 Code | e0 |
| Memory Width | 16 |
| Technology | CMOS |
| Contact Plating | Lead, Tin |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 1.8V |
| Programming Voltage | 1.8V |
| Published | 2007 |
| Terminal Pitch | 1mm |
| Memory IC Type | FLASH |
| Width | 10mm |
| Supply Voltage-Max (Vsup) | 2V |
| Terminal Position | BOTTOM |
| Number of Terminations | 64 |
| Number of Pins | 64 |
| Pin Count | 64 |
| Height Seated (Max) | 1.2mm |
| Terminal Form | BALL |
| Supply Voltage-Min (Vsup) | 1.7V |
| Peak Reflow Temperature (Cel) | 225 |
| Length | 13mm |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Parallel/Serial | PARALLEL |
| Programmable Type | In System Programmable |
| Subcategory | Flash Memories |
| Memory Density | 134217728 bit |
| Access Time (Max) | 85 ns |
| Voltage – Supply | 1.7V~2V |
| Power Supplies | 1.81.8/3.3V |
| Organization | 8MX16 |
| Memory Size | 128MB |
| Package / Case | 64-TBGA |
| Page Size | 4words |
| Number of Sectors/Size | 4127 |
| Supply Current-Max | 0.053mA |
| Standby Current-Max | 0.000075A |
| Base Part Number | XCF128X |
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