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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
ECCN Code | EAR99 |
Pbfree Code | yes |
Radiation Hardening | No |
Surface Mount | YES |
JESD-609 Code | e3 |
Memory Width | 8 |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Packaging | Tray |
Factory Lead Time | 10 Weeks |
Terminal Form | GULL WING |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Data Retention Time-Min | 20 |
Terminal Finish | Matte Tin (Sn) |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Supply Voltage-Min (Vsup) | 3V |
Terminal Position | QUAD |
Length | 10mm |
Width | 10mm |
Supply Voltage-Max (Vsup) | 3.6V |
Number of Terminations | 44 |
Number of Pins | 44 |
Pin Count | 44 |
Terminal Pitch | 0.8mm |
Operating Temperature | 0°C~70°C |
Height Seated (Max) | 1.2mm |
Clock Frequency | 20MHz |
Published | 1999 |
Voltage – Supply | 3V~3.6V |
Access Time (Max) | 20 ns |
HTS Code | 8542.32.00.51 |
Programmable Type | In System Programmable |
Standby Current-Max | 0.01A |
Package / Case | 44-TQFP |
Subcategory | Flash Memories |
Supply Current-Max | 0.025mA |
Density | 2 Mb |
Organization | 256KX8 |
Memory IC Type | CONFIGURATION MEMORY |
Parallel/Serial | PARALLEL/SERIAL |
Endurance | 20000 Write/Erase Cycles |
Base Part Number | XC18V02 |
*The following components have specifications similar
*The following five components have specifications similar