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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Part Status | Obsolete |
| Memory Width | 8 |
| Packaging | Tube |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Pbfree Code | no |
| JESD-609 Code | e0 |
| Technology | CMOS |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage-Min (Vsup) | 3V |
| Terminal Pitch | 1.27mm |
| Terminal Position | QUAD |
| Supply Voltage-Max (Vsup) | 3.6V |
| Number of Terminations | 44 |
| Number of Pins | 44 |
| Pin Count | 44 |
| Operating Temperature | 0°C~70°C |
| Terminal Form | J BEND |
| Terminal Finish | TIN LEAD |
| Published | 1999 |
| Voltage – Supply | 3V~3.6V |
| Peak Reflow Temperature (Cel) | 225 |
| Access Time (Max) | 20 ns |
| Height Seated (Max) | 4.572mm |
| Programmable Type | In System Programmable |
| Package / Case | 44-LCC (J-Lead) |
| Length | 16.5862mm |
| Width | 16.5862mm |
| Density | 2 Mb |
| HTS Code | 8542.32.00.61 |
| Organization | 256KX8 |
| Memory IC Type | CONFIGURATION MEMORY |
| Parallel/Serial | PARALLEL/SERIAL |
| ECCN Code | 3A991.B.1 |
| Base Part Number | XC18V02 |
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