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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
ECCN Code | EAR99 |
Radiation Hardening | No |
Surface Mount | YES |
Boundary Scan | YES |
Packaging | Tray |
Factory Lead Time | 10 Weeks |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Height Seated (Max) | 1.6mm |
Published | 2008 |
HTS Code | 8542.39.00.01 |
Terminal Position | BOTTOM |
Terminal Pitch | 0.8mm |
Terminal Form | BALL |
Supply Voltage | 1V |
Operating Supply Voltage | 1V |
JESD-609 Code | e1 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Contact Plating | Copper, Silver, Tin |
Data Bus Width | 32b |
Length | 17mm |
Core Architecture | ARM |
Operating Temperature | -40°C~100°C TJ |
Number of I/O | 130 |
RAM Size | 256kB |
Number of Terminations | 400 |
Number of Pins | 400 |
Architecture | MCU, FPGA |
Supply Voltage-Max (Vsup) | 1.05V |
Frequency | 667MHz |
Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Peripherals | DMA |
Series | Zynq?-7000 |
Speed Grade | -1 |
Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
RAM (words) | 256000 |
Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
Package / Case | 400-LFBGA, CSPBGA |
Primary Attributes | Artix?-7 FPGA, 28K Logic Cells |
Base Part Number | XC7Z010 |
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