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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Flash Size | – |
| Package | Tray |
| RAM Size | 256kB |
| Architecture | MCU, FPGA |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Peripherals | DMA, WDT |
| Category | Integrated Circuits (ICs)/Embedded – System On Chip (SoC) |
| Number of I/O | 252 |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Mfr | Xilinx Inc. |
| Core Processor | Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? |
| Series | Zynq? UltraScale+? MPSoC CG |
| Package / Case | 784-BFBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq?UltraScale+? FPGA, 192K+ Logic Cells |
| Supplier Device Package | 784-FCBGA (23×23) |
*The following components have specifications similar
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