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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Surface Mount | YES |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Packaging | Tray |
Published | 2016 |
Technology | CMOS |
Factory Lead Time | 11 Weeks |
Terminal Position | BOTTOM |
Terminal Form | BALL |
HTS Code | 8542.31.00.01 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
RAM Size | 256kB |
Architecture | MCU, FPGA |
Number of I/O | 360 |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
Operating Temperature | 0°C~100°C TJ |
Peripherals | DMA, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Package / Case | 1156-BBGA, FCBGA |
Supply Voltage | 0.72V |
Supply Voltage-Min (Vsup) | 0.698V |
Supply Voltage-Max (Vsup) | 0.742V |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
Core Processor | Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? |
Series | Zynq? UltraScale+? MPSoC CG |
Primary Attributes | Zynq?UltraScale+? FPGA, 504K+ Logic Cells |
Speed | 533MHz, 1.3GHz |
JESD-30 Code | R-PBGA-B1156 |
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