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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Packaging | Tray |
| Published | 2016 |
| Factory Lead Time | 11 Weeks |
| HTS Code | 8542.31.00.01 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| RAM Size | 256kB |
| Architecture | MCU, FPGA |
| Number of I/O | 360 |
| Operating Temperature | 0°C~100°C TJ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package / Case | 1156-BBGA, FCBGA |
| Core Processor | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 |
| Series | Zynq? UltraScale+? MPSoC EG |
| Primary Attributes | Zynq?UltraScale+? FPGA, 504K+ Logic Cells |
| Speed | 600MHz, 667MHz, 1.5GHz |
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