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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusNon-RoHS Compliant
Surface MountYES
Boundary ScanYES
PackagingTray
Pbfree Codeno
Factory Lead Time10 Weeks
TechnologyCMOS
Published2010
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal FormBALL
Moisture Sensitivity Level (MSL)4 (72 Hours)
Core ArchitectureARM
Number of I/O130
Frequency800MHz
RAM Size256kB
Number of Terminations900
ArchitectureMCU, FPGA
Operating Temperature0°C~100°C TJ
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case900-BBGA, FCBGA
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM (words)256000
JESD-30 CodeS-PBGA-B900
Primary AttributesKintex?-7 FPGA, 350K Logic Cells
Bus CompatibilityCAN, ETHERNET, I2C, PCI, SPI, UART, USB
Additional FeatureGPIO WITH FOUR 32-BIT BANKS

Manufacturer introduction

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