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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Packaging | Bulk |
Published | 2010 |
Factory Lead Time | 11 Weeks |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Number of I/O | 130 |
Speed | 800MHz |
RAM Size | 256kB |
Architecture | MCU, FPGA |
Operating Temperature | 0°C~100°C TJ |
Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Package / Case | 676-BBGA, FCBGA |
Peripherals | DMA |
Series | Zynq?-7000 |
Supplier Device Package | 676-FCBGA (27×27) |
Primary Attributes | Kintex?-7 FPGA, 275K Logic Cells |
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