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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Number of Functions | 1 |
| Pbfree Code | yes |
| Surface Mount | YES |
| Part Status | Obsolete |
| Packaging | Tray |
| Published | 2013 |
| Qualification Status | Not Qualified |
| Memory Width | 16 |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Operating Temperature (Max) | 85°C |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Number of Terminations | 56 |
| Pin Count | 56 |
| Height Seated (Max) | 1.2mm |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Width | 6mm |
| Operating Temperature (Min) | -25°C |
| Length | 8mm |
| Supply Voltage-Min (Vsup) | 1.7V |
| Temperature Grade | OTHER |
| Operating Mode | ASYNCHRONOUS |
| Terminal Finish | TIN SILVER COPPER |
| Supply Voltage-Max (Vsup) | 1.95V |
| HTS Code | 8542.32.00.71 |
| Memory Density | 134217728 bit |
| Organization | 8MX16 |
| Memory IC Type | MEMORY CIRCUIT |
| JESD-30 Code | R-PBGA-B56 |
| Base Part Number | M36L0R7060 |
*The following components have specifications similar
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