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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Mounting Type | Surface Mount |
Number of Functions | 1 |
RoHS Status | Non-RoHS Compliant |
Surface Mount | YES |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Supply Voltage | 3.3V |
Packaging | Tray |
Pbfree Code | no |
Qualification Status | Not Qualified |
JESD-609 Code | e0 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Pitch | 1.27mm |
Operating Temperature | -40°C~85°C TA |
Terminal Position | BOTTOM |
Memory Width | 36 |
Memory Interface | Parallel |
Width | 14mm |
Output Characteristics | 3-STATE |
Memory Type | Volatile |
Clock Frequency | 200MHz |
Memory Format | SRAM |
Voltage – Supply | 3.135V~3.465V |
Length | 22mm |
I/O Type | COMMON |
Height Seated (Max) | 2.41mm |
Supply Voltage-Max (Vsup) | 3.465V |
Supply Voltage-Min (Vsup) | 3.135V |
Standby Current-Max | 0.05A |
HTS Code | 8542.32.00.41 |
Additional Feature | PIPELINED ARCHITECTURE |
ECCN Code | 3A991.B.2.A |
Technology | SRAM – Synchronous, SDR |
Pin Count | 119 |
Number of Terminations | 119 |
Number of Pins | 119 |
Standby Voltage-Min | 3.14V |
Memory Size | 9Mb 256K x 36 |
Power Supplies | 2.5/3.33.3V |
Organization | 256KX36 |
Memory Density | 9437184 bit |
Access Time | 3.1ns |
Supply Current-Max | 0.28mA |
Package / Case | 119-BBGA |
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