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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | RoHS Compliant |
| Packaging | Tray |
| Max Operating Temperature | 85°C |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Published | 2009 |
| Factory Lead Time | 11 Weeks |
| Min Operating Temperature | 0°C |
| Operating Supply Voltage | 1.2V |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Core Architecture | ARM |
| Operating Temperature | 0°C~85°C TJ |
| Frequency | 166MHz |
| Speed | 166MHz |
| Max Frequency | 400MHz |
| Number of Pins | 484 |
| RAM Size | 64kB |
| Core Processor | ARM? Cortex?-M3 |
| Memory Size | 256kB |
| Architecture | MCU, FPGA |
| Flash Size | 256KB |
| Package / Case | 484-BGA |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Series | SmartFusion?2 |
| Peripherals | DDR, PCIe, SERDES |
| Supplier Device Package | 484-FPBGA (23×23) |
| Number of I/O | 267 |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of Logic Blocks (LABs) | 2308 |
| Number of Logic Elements/Cells | 27696 |
| Primary Attributes | FPGA – 25K Logic Modules |
| Base Part Number | M2S025 |
| Data Rate | 667 Mbps |
*The following components have specifications similar
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