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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
Surface MountYES
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Peak Reflow Temperature (Cel)NOT SPECIFIED
PackagingTray
Published2016
TechnologyCMOS
Factory Lead Time11 Weeks
Terminal PositionBOTTOM
Terminal FormBALL
HTS Code8542.31.00.01
Moisture Sensitivity Level (MSL)4 (72 Hours)
Number of I/O82
Number of Terminations484
RAM Size256kB
ArchitectureMCU, FPGA
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
Operating Temperature0°C~100°C TJ
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Supply Voltage0.72V
Supply Voltage-Min (Vsup)0.698V
Supply Voltage-Max (Vsup)0.742V
Additional FeatureALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Core ProcessorDual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
SeriesZynq? UltraScale+? MPSoC CG
JESD-30 CodeR-PBGA-B484
Speed533MHz, 1.3GHz
Primary AttributesZynq?UltraScale+? FPGA, 103K+ Logic Cells
Package / Case484-BFBGA, FCBGA

Manufacturer introduction

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