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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Surface Mount | YES |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Supply Voltage | 3.3V |
Packaging | Tray |
Pbfree Code | no |
Qualification Status | Not Qualified |
JESD-609 Code | e0 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Pitch | 1mm |
Terminal Position | BOTTOM |
Memory Width | 36 |
Memory Interface | Parallel |
Height Seated (Max) | 1.2mm |
Operating Temperature | 0°C~70°C TA |
Output Characteristics | 3-STATE |
Length | 15mm |
Memory Type | Volatile |
Memory Format | SRAM |
Voltage – Supply | 3.135V~3.465V |
Width | 13mm |
I/O Type | COMMON |
Supply Voltage-Max (Vsup) | 3.465V |
Supply Voltage-Min (Vsup) | 3.135V |
Clock Frequency | 133MHz |
Number of Pins | 165 |
Number of Terminations | 165 |
Pin Count | 165 |
HTS Code | 8542.32.00.41 |
ECCN Code | 3A991.B.2.A |
Technology | SRAM – Synchronous, SDR |
Standby Voltage-Min | 3.14V |
Standby Current-Max | 0.06A |
Access Time | 6.5ns |
Memory Size | 18Mb 512K x 36 |
Package / Case | 165-TBGA |
Additional Feature | FLOW-THROUGH ARCHITECTURE |
Power Supplies | 2.5/3.33.3V |
Memory Density | 18874368 bit |
Organization | 512KX36 |
Supply Current-Max | 0.45mA |
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