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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Part Status | Obsolete |
Packaging | Tray |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Factory Lead Time | 13 Weeks |
Operating Temperature | -40°C~85°C TA |
Memory Format | FLASH |
Programming Voltage | 2.7V |
Memory Type | Non-Volatile |
Technology | FLASH – NAND |
Memory Interface | MMC |
Series | e?MMC? |
Memory Size | 512Gb 64G x 8 |
Package / Case | 153-LFBGA |
Terminal Finish | Tin/Silver/Copper (Sn96.8Ag3.0Cu0.2) |
*The following components have specifications similar
*The following five components have specifications similar