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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Mount | Surface Mount |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| ECCN Code | EAR99 |
| Retransmit Capability | No |
| Output Enable | YES |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Moisture Sensitivity Level (MSL) | 3 |
| Temperature Grade | COMMERCIAL |
| Pbfree Code | no |
| FWFT Support | Yes |
| Lead Free | Contains Lead |
| JESD-609 Code | e0 |
| Technology | CMOS |
| Contact Plating | Lead, Tin |
| Max Operating Temperature | 70°C |
| Element Configuration | Dual |
| Factory Lead Time | 7 Weeks |
| Published | 2005 |
| Terminal Pitch | 1mm |
| Max Supply Voltage | 3.6V |
| Terminal Position | BOTTOM |
| Nominal Supply Current | 100mA |
| Min Operating Temperature | 0°C |
| Terminal Form | BALL |
| Bus Directional | Unidirectional |
| Number of Terminations | 256 |
| Number of Pins | 256 |
| Pin Count | 256 |
| Peak Reflow Temperature (Cel) | 225 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Sync/Async | Synchronous |
| Length | 17mm |
| Width | 17mm |
| Frequency | 133MHz |
| Frequency (Max) | 133MHz |
| Parallel/Serial | PARALLEL |
| Min Supply Voltage | 3.15V |
| Package / Case | BGA |
| Cycle Time | 7.5 ns |
| Access Time | 4 ns |
| Word Size | 18b |
| Subcategory | FIFOs |
| HTS Code | 8542.32.00.71 |
| Memory IC Type | OTHER FIFO |
| Standby Current-Max | 0.01A |
| Density | 1.1 Mb |
| Thickness | 1.76mm |
| Organization | 64KX18 |
| Additional Feature | ALTERNATIVE MEMORY WIDTH:9-BIT |
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