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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Mount | Surface Mount |
Number of Functions | 1 |
RoHS Status | RoHS Compliant |
ECCN Code | EAR99 |
Pbfree Code | yes |
Retransmit Capability | No |
Output Enable | YES |
Lead Free | Lead Free |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Moisture Sensitivity Level (MSL) | 3 |
Temperature Grade | COMMERCIAL |
FWFT Support | Yes |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Max Operating Temperature | 70°C |
Time@Peak Reflow Temperature-Max (s) | 30 |
Element Configuration | Dual |
Factory Lead Time | 7 Weeks |
Published | 2005 |
Terminal Pitch | 1mm |
Terminal Position | BOTTOM |
Min Operating Temperature | 0°C |
Terminal Form | BALL |
JESD-609 Code | e1 |
Bus Directional | Unidirectional |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Height Seated (Max) | 3.5mm |
Number of Terminations | 256 |
Number of Pins | 256 |
Pin Count | 256 |
Contact Plating | Copper, Silver, Tin |
Length | 17mm |
Width | 17mm |
Frequency (Max) | 166MHz |
Parallel/Serial | PARALLEL |
Min Supply Voltage | 3.15V |
Cycle Time | 6 ns |
Standby Current-Max | 0.025A |
Subcategory | FIFOs |
HTS Code | 8542.32.00.71 |
Memory IC Type | OTHER FIFO |
Max Supply Voltage | 3.45V |
Supply Current-Max | 0.1mA |
Access Time (Max) | 3.7 ns |
Thickness | 1.76mm |
Memory Density | 2359296 bit |
Organization | 128KX18 |
Additional Feature | ALTERNATIVE MEMORY WIDTH:9-BIT |
Weight | 1.724105g |
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