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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
Surface MountYES
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Peak Reflow Temperature (Cel)NOT SPECIFIED
PackagingTray
Published2016
TechnologyCMOS
Factory Lead Time11 Weeks
Terminal PositionBOTTOM
Terminal FormBALL
HTS Code8542.31.00.01
Moisture Sensitivity Level (MSL)4 (72 Hours)
RAM Size256kB
Number of Terminations900
ArchitectureMCU, FPGA
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
Operating Temperature0°C~100°C TJ
PeripheralsDMA, WDT
Number of I/O204
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case900-BBGA, FCBGA
Supply Voltage0.72V
Supply Voltage-Min (Vsup)0.698V
Supply Voltage-Max (Vsup)0.742V
Additional FeatureALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Core ProcessorDual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
SeriesZynq? UltraScale+? MPSoC CG
Speed533MHz, 1.3GHz
JESD-30 CodeR-PBGA-B900
Primary AttributesZynq?UltraScale+? FPGA, 469K+ Logic Cells

Manufacturer introduction

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