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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
Surface MountYES
PackagingTray
Published2016
TechnologyCMOS
Factory Lead Time11 Weeks
Terminal PositionBOTTOM
Terminal FormBALL
HTS Code8542.31.00.01
Moisture Sensitivity Level (MSL)4 (72 Hours)
RAM Size256kB
ArchitectureMCU, FPGA
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
Operating Temperature0°C~100°C TJ
PeripheralsDMA, WDT
Number of I/O252
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Number of Terminations784
Supply Voltage0.72V
Core ProcessorDual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
SeriesZynq? UltraScale+? MPSoC CG
Package / Case784-BFBGA, FCBGA
JESD-30 CodeS-PBGA-B784
Speed533MHz, 1.3GHz
Primary AttributesZynq?UltraScale+? FPGA, 256K+ Logic Cells
Additional FeatureIT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

Manufacturer introduction

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