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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Packaging | Tray |
| Published | 2016 |
| Factory Lead Time | 11 Weeks |
| HTS Code | 8542.31.00.01 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| RAM Size | 256kB |
| Architecture | MCU, FPGA |
| Peripherals | DMA, WDT |
| Number of I/O | 252 |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package / Case | 784-BFBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| Core Processor | Dual ARM?? Cortex??-A53 MPCore邃? with CoreSight邃?, Dual ARM??Cortex邃?-R5 with CoreSight邃? |
| Series | Zynq?? UltraScale+邃? MPSoC CG |
| Primary Attributes | Zynq??UltraScale+邃? FPGA, 192K+ Logic Cells |
| Operating Temperature | 0??C￣100??C TJ |
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