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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
Surface MountYES
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Peak Reflow Temperature (Cel)NOT SPECIFIED
PackagingTray
Published2016
TechnologyCMOS
Factory Lead Time11 Weeks
Terminal PositionBOTTOM
Terminal FormBALL
HTS Code8542.31.00.01
Moisture Sensitivity Level (MSL)4 (72 Hours)
RAM Size256kB
ArchitectureMCU, FPGA
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
Package / Case1517-BBGA, FCBGA
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Supply Voltage0.72V
Speed533MHz, 600MHz, 1.3GHz
Supply Voltage-Min (Vsup)0.698V
Supply Voltage-Max (Vsup)0.742V
Additional FeatureALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Number of I/O644
JESD-30 CodeR-PBGA-B1517
Operating Temperature0?°C~100?°C TJ
Core ProcessorQuad ARM?? Cortex??-A53 MPCorea?? with CoreSighta??, Dual ARM??Cortexa??-R5 with CoreSighta??, ARM Malia??-400 MP2
SeriesZynq?? UltraScale+a?? MPSoC EG
Primary AttributesZynq??UltraScale+a?? FPGA, 926K+ Logic Cells

Manufacturer introduction

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