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TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Surface Mount | YES |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Packaging | Tray |
Published | 2016 |
Technology | CMOS |
Factory Lead Time | 11 Weeks |
Terminal Position | BOTTOM |
Terminal Form | BALL |
HTS Code | 8542.31.00.01 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
RAM Size | 256kB |
Architecture | MCU, FPGA |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
Peripherals | DMA, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Number of I/O | 668 |
Supply Voltage | 0.72V |
Package / Case | 1924-BBGA, FCBGA |
Speed | 500MHz, 600MHz, 1.2GHz |
Supply Voltage-Min (Vsup) | 0.698V |
Supply Voltage-Max (Vsup) | 0.742V |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
Series | Zynq?? UltraScale+邃? MPSoC EG |
Core Processor | Quad ARM?? Cortex??-A53 MPCore邃? with CoreSight邃?, Dual ARM??Cortex邃?-R5 with CoreSight邃?, ARM Mali邃?-400 MP2 |
Operating Temperature | -40??C~100??C TJ |
JESD-30 Code | R-PBGA-B1924 |
Primary Attributes | Zynq??UltraScale+邃? FPGA, 926K+ Logic Cells |
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