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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Mount | Surface Mount |
Number of Functions | 1 |
Pbfree Code | yes |
Radiation Hardening | No |
JESD-609 Code | e3 |
Lead Free | Lead Free |
Terminal Position | DUAL |
Packaging | Tray |
Operating Temperature | -40°C~85°C |
Factory Lead Time | 10 Weeks |
Terminal Form | GULL WING |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Data Retention Time-Min | 20 |
Terminal Finish | Matte Tin (Sn) |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Supply Voltage | 1.8V |
Operating Supply Voltage | 1.8V |
Terminal Pitch | 0.5mm |
Height | 1mm |
Number of Terminations | 48 |
Number of Pins | 48 |
Pin Count | 48 |
Supply Voltage-Max (Vsup) | 2V |
Published | 1999 |
Parallel/Serial | SERIAL |
Supply Voltage-Min (Vsup) | 1.65V |
Width | 18.5mm |
Programmable Type | In System Programmable |
Supply Current-Max | 0.04mA |
Subcategory | Flash Memories |
Package / Case | 48-TFSOP (0.724, 18.40mm Width) |
Length | 12.1mm |
Standby Current-Max | 0.001A |
Memory Density | 33554432 bit |
HTS Code | 8542.32.00.61 |
Memory Size | 32MB |
Memory IC Type | CONFIGURATION MEMORY |
Voltage – Supply | 1.65V~2V |
Organization | 32MX1 |
Endurance | 20000 Write/Erase Cycles |
ECCN Code | 3A991.B.1 |
Base Part Number | XCF*P |
*The following components have specifications similar
*The following five components have specifications similar