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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Mount | Surface Mount |
| Number of Functions | 1 |
| ECCN Code | EAR99 |
| Pbfree Code | yes |
| Lead Free | Lead Free |
| Packaging | Tray |
| Operating Temperature | -40°C~85°C |
| Factory Lead Time | 10 Weeks |
| Qualification Status | Not Qualified |
| Termination | SMD/SMT |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Data Retention Time-Min | 20 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage | 1.8V |
| REACH SVHC | Unknown |
| Number of Terminations | 48 |
| Number of Pins | 48 |
| Pin Count | 48 |
| Supply Voltage-Max (Vsup) | 2V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Width | 8mm |
| Published | 1999 |
| Length | 9mm |
| JESD-609 Code | e2 |
| Operating Mode | SYNCHRONOUS |
| Supply Voltage-Min (Vsup) | 1.65V |
| HTS Code | 8542.32.00.51 |
| Programmable Type | In System Programmable |
| Supply Current-Max | 0.04mA |
| Subcategory | Flash Memories |
| Interface | Parallel, Serial |
| Height | 860μm |
| Memory Density | 33554432 bit |
| Memory Size | 32MB |
| Voltage – Supply | 1.65V~2V |
| Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) |
| Organization | 32MX1 |
| Power Supplies | 1.5/3.31.8V |
| Package / Case | 48-TFBGA, CSPBGA |
| Endurance | 20000 Write/Erase Cycles |
| Base Part Number | XCF*P |
| Additional Feature | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL |
*The following components have specifications similar
*The following five components have specifications similar
