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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Mount | Surface Mount |
Number of Functions | 1 |
ECCN Code | EAR99 |
Pbfree Code | yes |
Radiation Hardening | No |
Lead Free | Lead Free |
Packaging | Tray |
Operating Temperature | -40°C~85°C |
Factory Lead Time | 10 Weeks |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 30 |
Supply Voltage | 1.8V |
Operating Supply Voltage | 1.8V |
REACH SVHC | Unknown |
Memory Type | FLASH |
Number of Terminations | 48 |
Number of Pins | 48 |
Pin Count | 48 |
Supply Voltage-Max (Vsup) | 2V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Width | 8mm |
Published | 1999 |
Frequency | 50MHz |
Length | 9mm |
JESD-609 Code | e2 |
Supply Voltage-Min (Vsup) | 1.65V |
HTS Code | 8542.32.00.51 |
Programmable Type | In System Programmable |
Supply Current-Max | 0.04mA |
Interface | Parallel, Serial |
Height | 860μm |
Standby Current-Max | 0.001A |
Memory Density | 8388608 bit |
Voltage – Supply | 1.65V~2V |
Memory Size | 8MB |
Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) |
Package / Case | 48-TFBGA, CSPBGA |
Organization | 8MX1 |
Endurance | 20000 Write/Erase Cycles |
Base Part Number | XCF*P |
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