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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mount | Surface Mount |
| Boundary Scan | YES |
| Packaging | Tray |
| Factory Lead Time | 10 Weeks |
| Technology | CMOS |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Published | 2010 |
| Terminal Pitch | 1mm |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1V |
| JESD-609 Code | e1 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Peak Reflow Temperature (Cel) | 245 |
| Contact Plating | Copper, Silver, Tin |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Core Architecture | ARM |
| Operating Temperature | -40°C~100°C TJ |
| Number of I/O | 130 |
| Length | 31mm |
| Width | 31mm |
| Frequency | 800MHz |
| RAM Size | 256kB |
| Number of Terminations | 900 |
| Number of Pins | 900 |
| Architecture | MCU, FPGA |
| Max Supply Voltage | 1.05V |
| ECCN Code | 3A991.D |
| Height Seated (Max) | 3.35mm |
| Min Supply Voltage | 950mV |
| Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package / Case | 900-BBGA, FCBGA |
| Peripherals | DMA |
| Series | Zynq?-7000 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Propagation Delay | 120 ps |
| Turn On Delay Time | 120 ps |
| RAM (words) | 256000 |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| Primary Attributes | Kintex?-7 FPGA, 444K Logic Cells |
| Number of Registers | 554800 |
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