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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
MountSurface Mount
Radiation HardeningNo
Boundary ScanYES
PackagingTray
Factory Lead Time10 Weeks
TechnologyCMOS
Time@Peak Reflow Temperature-Max (s)30
Published2010
Terminal Pitch1mm
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal FormBALL
Supply Voltage1V
JESD-609 Codee1
Peak Reflow Temperature (Cel)245
Contact PlatingCopper, Silver, Tin
Moisture Sensitivity Level (MSL)4 (72 Hours)
Data Bus Width32b
Core ArchitectureARM
Operating Temperature-40°C~100°C TJ
Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Length31mm
Frequency800MHz
RAM Size256kB
Number of Terminations900
Number of Pins900
Supply Voltage-Min (Vsup)0.95V
ArchitectureMCU, FPGA
Supply Voltage-Max (Vsup)1.05V
ECCN Code3A991.D
Height Seated (Max)3.35mm
Number of I/O212
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case900-BBGA, FCBGA
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM (words)256000
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
Primary AttributesKintex?-7 FPGA, 444K Logic Cells
Base Part NumberXC7Z100

Manufacturer introduction

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