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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
MountSurface Mount
Boundary ScanYES
PackagingTray
Factory Lead Time10 Weeks
TechnologyCMOS
Time@Peak Reflow Temperature-Max (s)30
Published2010
Reach Compliance Codenot_compliant
Terminal Pitch1mm
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal FormBALL
Supply Voltage1V
JESD-609 Codee1
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Length35mm
Peak Reflow Temperature (Cel)245
Contact PlatingCopper, Silver, Tin
Moisture Sensitivity Level (MSL)4 (72 Hours)
Height Seated (Max)3.1mm
Data Bus Width32b
Core ArchitectureARM
Operating Temperature-40°C~100°C TJ
Number of I/O250
RAM Size256kB
Supply Voltage-Min (Vsup)0.95V
ArchitectureMCU, FPGA
Supply Voltage-Max (Vsup)1.05V
ECCN Code3A991.D
Frequency667MHz
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case1156-BBGA, FCBGA
PeripheralsDMA
SeriesZynq?-7000
Speed Grade-1
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM (words)256000
JESD-30 CodeS-PBGA-B1156
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
Primary AttributesKintex?-7 FPGA, 444K Logic Cells

Manufacturer introduction

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