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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | Non-RoHS Compliant |
| Packaging | Tray |
| Factory Lead Time | 10 Weeks |
| Min Operating Temperature | -40°C |
| Published | 2010 |
| Max Operating Temperature | 100°C |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Operating Temperature | -40°C~100°C TJ |
| Number of I/O | 130 |
| RAM Size | 256kB |
| Architecture | MCU, FPGA |
| Speed | 667MHz |
| Frequency | 667MHz |
| Max Frequency | 667MHz |
| Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package / Case | 900-BBGA, FCBGA |
| Peripherals | DMA |
| Series | Zynq?-7000 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Supplier Device Package | 900-FCBGA (31×31) |
| Primary Attributes | Kintex?-7 FPGA, 444K Logic Cells |
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