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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Mount | Surface Mount |
Boundary Scan | YES |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Packaging | Tray |
Factory Lead Time | 10 Weeks |
Technology | CMOS |
Published | 2010 |
Terminal Pitch | 1mm |
HTS Code | 8542.39.00.01 |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Supply Voltage | 1V |
JESD-609 Code | e1 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Contact Plating | Copper, Silver, Tin |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Core Architecture | ARM |
Operating Temperature | -40°C~100°C TJ |
Length | 27mm |
Width | 27mm |
Number of I/O | 130 |
Frequency | 800MHz |
RAM Size | 256kB |
Architecture | MCU, FPGA |
Max Supply Voltage | 1.05V |
ECCN Code | 3A991.D |
Number of Terminations | 676 |
Min Supply Voltage | 950mV |
Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Package / Case | 676-BBGA, FCBGA |
JESD-30 Code | S-PBGA-B676 |
Propagation Delay | 100 ps |
Peripherals | DMA |
Series | Zynq?-7000 |
Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
RAM (words) | 256000 |
Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
Height Seated (Max) | 3.37mm |
Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
Primary Attributes | Kintex?-7 FPGA, 350K Logic Cells |
Number of Registers | 437200 |
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