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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
MountSurface Mount
Boundary ScanYES
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Peak Reflow Temperature (Cel)NOT SPECIFIED
PackagingTray
Factory Lead Time10 Weeks
TechnologyCMOS
Published2010
Terminal Pitch1mm
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal FormBALL
Supply Voltage1V
JESD-609 Codee1
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Contact PlatingCopper, Silver, Tin
Moisture Sensitivity Level (MSL)4 (72 Hours)
Core ArchitectureARM
Operating Temperature-40°C~100°C TJ
Length27mm
Width27mm
Number of I/O130
Frequency800MHz
RAM Size256kB
ArchitectureMCU, FPGA
Max Supply Voltage1.05V
ECCN Code3A991.D
Number of Terminations676
Min Supply Voltage950mV
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case676-BBGA, FCBGA
JESD-30 CodeS-PBGA-B676
Propagation Delay100 ps
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM (words)256000
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)3.37mm
Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Primary AttributesKintex?-7 FPGA, 350K Logic Cells
Number of Registers437200

Manufacturer introduction

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