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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
Radiation HardeningNo
Surface MountYES
Boundary ScanYES
PackagingTray
Factory Lead Time10 Weeks
TechnologyCMOS
Time@Peak Reflow Temperature-Max (s)30
Published2009
Terminal Pitch1mm
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal FormBALL
Supply Voltage1V
Operating Supply Voltage1V
JESD-609 Codee1
Peak Reflow Temperature (Cel)245
Contact PlatingCopper, Silver, Tin
Moisture Sensitivity Level (MSL)4 (72 Hours)
Data Bus Width32b
Core ArchitectureARM
Number of I/O130
Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Length31mm
RAM Size256kB
Number of Terminations900
Frequency1GHz
ArchitectureMCU, FPGA
Memory TypeROMless
Supply Voltage-Max (Vsup)1.05V
ECCN Code3A991.D
Operating Temperature0°C~100°C TJ
Height Seated (Max)3.35mm
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case900-BBGA, FCBGA
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM (words)256000
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
JESD-30 CodeS-PBGA-B900
Speed Grade-3
Primary AttributesKintex?-7 FPGA, 350K Logic Cells
Base Part NumberXC7Z045

Manufacturer introduction

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