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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusNon-RoHS Compliant
Surface MountYES
Boundary ScanYES
PackagingTray
Published2016
Factory Lead Time10 Weeks
TechnologyCMOS
Reach Compliance Codecompliant
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal FormBALL
Moisture Sensitivity Level (MSL)4 (72 Hours)
Operating Temperature-40°C~100°C TJ
Number of I/O130
Clock Frequency800MHz
Speed800MHz
RAM Size256kB
Number of Terminations900
ArchitectureMCU, FPGA
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case900-BBGA, FCBGA
PeripheralsDMA
SeriesZynq?-7000
RAM (words)256000
JESD-30 CodeS-PBGA-B900
Primary AttributesKintex?-7 FPGA, 350K Logic Cells
Bus CompatibilityCAN, ETHERNET, I2C, PCI, SPI, UART, USB
Additional FeatureGPIO WITH FOUR 32-BIT BANKS

Manufacturer introduction

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