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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Boundary Scan | YES |
| Packaging | Tray |
| Pbfree Code | no |
| Factory Lead Time | 10 Weeks |
| Technology | CMOS |
| Published | 2010 |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Operating Temperature | -40°C~100°C TJ |
| Number of I/O | 130 |
| Frequency | 800MHz |
| RAM Size | 256kB |
| Architecture | MCU, FPGA |
| Memory Type | ROMless |
| Number of Terminations | 676 |
| Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package / Case | 676-BBGA, FCBGA |
| JESD-30 Code | S-PBGA-B676 |
| Peripherals | DMA |
| Series | Zynq?-7000 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| RAM (words) | 256000 |
| Primary Attributes | Kintex?-7 FPGA, 350K Logic Cells |
| Bus Compatibility | CAN, ETHERNET, I2C, PCI, SPI, UART, USB |
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