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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Radiation Hardening | No |
| Packaging | Tray |
| Factory Lead Time | 10 Weeks |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Published | 2009 |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 100°C |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Number of I/O | 130 |
| Frequency | 800MHz |
| Speed | 800MHz |
| RAM Size | 256kB |
| Architecture | MCU, FPGA |
| Operating Temperature | 0°C~100°C TJ |
| Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package / Case | 676-BBGA, FCBGA |
| Peripherals | DMA |
| Series | Zynq?-7000 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Speed Grade | -2 |
| Supplier Device Package | 676-FCBGA (27×27) |
| Primary Attributes | Kintex?-7 FPGA, 350K Logic Cells |
| Max Frequency | 733MHz |
| Base Part Number | XC7Z045 |
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