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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | RoHS Compliant |
| Part Status | Obsolete |
| Packaging | Tray |
| Max Operating Temperature | 85°C |
| Factory Lead Time | 7 Weeks |
| Published | 2010 |
| Min Operating Temperature | 0°C |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Core Architecture | ARM |
| Operating Temperature | 0°C~85°C TJ |
| Number of I/O | 130 |
| RAM Size | 256kB |
| Architecture | MCU, FPGA |
| Speed | 667MHz |
| Frequency | 667MHz |
| Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package / Case | 900-BBGA, FCBGA |
| Peripherals | DMA |
| Series | Zynq?-7000 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Primary Attributes | Kintex?-7 FPGA, 350K Logic Cells |
| Base Part Number | XC7Z045 |
| Supplier Device Package | 900-FCBGA (31×31) |
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