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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
Speed Grade2
MountSurface Mount
Boundary ScanYES
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Peak Reflow Temperature (Cel)NOT SPECIFIED
PackagingTray
Factory Lead Time10 Weeks
TechnologyCMOS
Published2010
Terminal Pitch1mm
Terminal PositionBOTTOM
Terminal FormBALL
Supply Voltage1V
JESD-609 Codee1
Contact PlatingCopper, Silver, Tin
Moisture Sensitivity Level (MSL)4 (72 Hours)
Core ArchitectureARM
Operating Temperature-40°C~100°C TJ
Number of I/O130
Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Frequency800MHz
RAM Size256kB
ArchitectureMCU, FPGA
Max Supply Voltage1.05V
ECCN Code3A991.D
Number of Terminations676
Min Supply Voltage950mV
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case676-BBGA, FCBGA
JESD-30 CodeS-PBGA-B676
Propagation Delay100 ps
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Primary AttributesKintex?-7 FPGA, 275K Logic Cells
Number of Registers343800

Manufacturer introduction

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