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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
MountSurface Mount
Speed Grade1
PackagingTray
Factory Lead Time10 Weeks
Max Operating Temperature85°C
Published2010
Min Operating Temperature0°C
Contact PlatingCopper, Silver, Tin
Moisture Sensitivity Level (MSL)4 (72 Hours)
Core ArchitectureARM
Operating Temperature0°C~85°C TJ
Number of I/O130
RAM Size256kB
ArchitectureMCU, FPGA
Max Supply Voltage1.05V
Speed667MHz
Frequency667MHz
Min Supply Voltage950mV
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case900-BBGA, FCBGA
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Propagation Delay120 ps
Primary AttributesKintex?-7 FPGA, 275K Logic Cells
Supplier Device Package900-FCBGA (31×31)
Number of Registers343800

Manufacturer introduction

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