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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mount | Surface Mount |
| Speed Grade | 1 |
| Boundary Scan | YES |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Packaging | Tray |
| Factory Lead Time | 10 Weeks |
| Height Seated (Max) | 2.54mm |
| Technology | CMOS |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Published | 2010 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1V |
| JESD-609 Code | e1 |
| Contact Plating | Copper, Silver, Tin |
| Core Architecture | ARM |
| Operating Temperature | 0°C~85°C TJ |
| Length | 27mm |
| Width | 27mm |
| Number of I/O | 130 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| RAM Size | 256kB |
| Architecture | MCU, FPGA |
| Max Supply Voltage | 1.05V |
| Number of Terminations | 676 |
| Frequency | 667MHz |
| Min Supply Voltage | 950mV |
| Core Processor | Dual ARM? Cortex?-A9 MPCore? with CoreSight? |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Package / Case | 676-BBGA, FCBGA |
| JESD-30 Code | S-PBGA-B676 |
| Peripherals | DMA |
| Series | Zynq?-7000 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Propagation Delay | 120 ps |
| RAM (words) | 256000 |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Primary Attributes | Kintex?-7 FPGA, 275K Logic Cells |
| Number of Registers | 343800 |
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