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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
ECCN CodeEAR99
Surface MountYES
Boundary ScanYES
PackagingTray
Factory Lead Time10 Weeks
Height Seated (Max)2.54mm
TechnologyCMOS
Moisture Sensitivity Level (MSL)3 (168 Hours)
Time@Peak Reflow Temperature-Max (s)30
Published2010
Reach Compliance Codenot_compliant
Terminal Pitch1mm
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal FormBALL
Supply Voltage1V
JESD-609 Codee1
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Core ArchitectureARM
Length23mm
Width23mm
Operating Temperature-40°C~100°C TJ
Number of Terminations484
Peak Reflow Temperature (Cel)250
Number of I/O130
Frequency800MHz
RAM Size256kB
Supply Voltage-Min (Vsup)0.95V
ArchitectureMCU, FPGA
Supply Voltage-Max (Vsup)1.05V
JESD-30 CodeS-PBGA-B484
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case484-BBGA, FCBGA
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM (words)256000
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
Primary AttributesKintex?-7 FPGA, 125K Logic Cells
Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

Manufacturer introduction

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