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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusNon-RoHS Compliant
Surface MountYES
Boundary ScanYES
PackagingTray
TechnologyCMOS
Published2009
Factory Lead Time11 Weeks
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal FormBALL
Moisture Sensitivity Level (MSL)4 (72 Hours)
Data Bus Width32b
Core ArchitectureARM
Operating Temperature-40°C~100°C TJ
Number of I/O130
Frequency800MHz
RAM Size256kB
ArchitectureMCU, FPGA
Number of Terminations676
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case676-BBGA, FCBGA
JESD-30 CodeS-PBGA-B676
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM (words)256000
Primary AttributesKintex?-7 FPGA, 125K Logic Cells
Base Part NumberXC7Z030
Bus CompatibilityCAN, ETHERNET, I2C, PCI, SPI, UART, USB

Manufacturer introduction

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