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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
MountSurface Mount
ECCN CodeEAR99
Boundary ScanYES
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Peak Reflow Temperature (Cel)NOT SPECIFIED
PackagingTray
Factory Lead Time10 Weeks
TechnologyCMOS
Moisture Sensitivity Level (MSL)3 (168 Hours)
Published2010
Height Seated (Max)1.6mm
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal Pitch0.8mm
Terminal FormBALL
Supply Voltage1V
JESD-609 Codee1
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Contact PlatingCopper, Silver, Tin
Core ArchitectureARM
Length19mm
Width19mm
Operating Temperature-40°C~100°C TJ
Number of I/O130
RAM Size256kB
ArchitectureMCU, FPGA
Max Supply Voltage1.05V
Frequency667MHz
Min Supply Voltage950mV
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Propagation Delay120 ps
RAM (words)256000
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
Number of Terminations485
Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Package / Case484-LFBGA, CSPBGA
Primary AttributesArtix?-7 FPGA, 74K Logic Cells
JESD-30 CodeS-PBGA-B485

Manufacturer introduction

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