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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
RoHS Status | ROHS3 Compliant |
Pbfree Code | yes |
Surface Mount | YES |
Boundary Scan | YES |
JESD-609 Code | e3 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Packaging | Tray |
Published | 2016 |
Factory Lead Time | 10 Weeks |
Technology | CMOS |
Terminal Finish | Matte Tin (Sn) |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Height Seated (Max) | 1.6mm |
Terminal Position | BOTTOM |
Terminal Pitch | 0.8mm |
Terminal Form | BALL |
Supply Voltage | 1V |
HTS Code | 8542.31.00.01 |
Length | 19mm |
Width | 19mm |
Number of I/O | 150 |
Clock Frequency | 800MHz |
RAM Size | 256kB |
Supply Voltage-Min (Vsup) | 0.95V |
Architecture | MCU, FPGA |
Supply Voltage-Max (Vsup) | 1.05V |
Operating Temperature | 0°C~100°C TJ |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Peripherals | DMA |
Series | Zynq?-7000 |
RAM (words) | 256000 |
Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
Number of Terminations | 485 |
Core Processor | Single ARM? Cortex?-A9 MPCore? with CoreSight? |
Speed | 766MHz |
Package / Case | 484-LFBGA, CSPBGA |
JESD-30 Code | S-PBGA-B485 |
Primary Attributes | Artix?-7 FPGA, 55K Logic Cells |
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