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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Pbfree Code | yes |
| Surface Mount | YES |
| Boundary Scan | YES |
| JESD-609 Code | e3 |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Packaging | Tray |
| Published | 2016 |
| Factory Lead Time | 10 Weeks |
| Technology | CMOS |
| Terminal Finish | Matte Tin (Sn) |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Height Seated (Max) | 1.6mm |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Terminal Form | BALL |
| Supply Voltage | 1V |
| HTS Code | 8542.31.00.01 |
| Operating Temperature | 0°C~85°C TJ |
| Length | 19mm |
| Width | 19mm |
| Number of I/O | 150 |
| RAM Size | 256kB |
| Supply Voltage-Min (Vsup) | 0.95V |
| Architecture | MCU, FPGA |
| Supply Voltage-Max (Vsup) | 1.05V |
| Clock Frequency | 667MHz |
| Speed | 667MHz |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA |
| Series | Zynq?-7000 |
| RAM (words) | 256000 |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Number of Terminations | 485 |
| Core Processor | Single ARM? Cortex?-A9 MPCore? with CoreSight? |
| Package / Case | 484-LFBGA, CSPBGA |
| JESD-30 Code | S-PBGA-B485 |
| Primary Attributes | Artix?-7 FPGA, 55K Logic Cells |
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