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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
MountSurface Mount
ECCN CodeEAR99
Boundary ScanYES
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Peak Reflow Temperature (Cel)NOT SPECIFIED
PackagingTray
Factory Lead Time10 Weeks
TechnologyCMOS
Moisture Sensitivity Level (MSL)3 (168 Hours)
Published2010
Height Seated (Max)1.6mm
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal Pitch0.8mm
Terminal FormBALL
Supply Voltage1V
JESD-609 Codee1
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Contact PlatingCopper, Silver, Tin
Length17mm
Width17mm
Core ArchitectureARM
Operating Temperature-40°C~100°C TJ
Number of I/O130
RAM Size256kB
Number of Terminations400
ArchitectureMCU, FPGA
Max Supply Voltage1.05V
Frequency667MHz
Min Supply Voltage950mV
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
JESD-30 CodeS-PBGA-B400
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM (words)256000
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
Package / Case400-LFBGA, CSPBGA
Additional FeaturePL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Primary AttributesArtix?-7 FPGA, 28K Logic Cells

Manufacturer introduction

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