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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
ECCN CodeEAR99
Radiation HardeningNo
Surface MountYES
Boundary ScanYES
PackagingTray
Factory Lead Time10 Weeks
TechnologyCMOS
Peak Reflow Temperature (Cel)260
Moisture Sensitivity Level (MSL)3 (168 Hours)
Time@Peak Reflow Temperature-Max (s)30
Published2010
Height Seated (Max)1.6mm
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal Pitch0.8mm
Terminal FormBALL
Supply Voltage1V
Operating Supply Voltage1V
JESD-609 Codee1
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Contact PlatingCopper, Silver, Tin
Data Bus Width32b
Length17mm
Core ArchitectureARM
Operating Temperature-40°C~100°C TJ
Number of I/O130
RAM Size256kB
Number of Terminations400
Number of Pins400
ArchitectureMCU, FPGA
Supply Voltage-Max (Vsup)1.05V
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA
SeriesZynq?-7000
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
RAM (words)256000
Speed Grade-2
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
Package / Case400-LFBGA, CSPBGA
Frequency766MHz
Primary AttributesArtix?-7 FPGA, 28K Logic Cells
Base Part NumberXC7Z010

Manufacturer introduction

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