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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
Surface MountYES
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Peak Reflow Temperature (Cel)NOT SPECIFIED
PackagingTray
TechnologyCMOS
Moisture Sensitivity Level (MSL)3 (168 Hours)
Factory Lead Time11 Weeks
Terminal PositionBOTTOM
Terminal Pitch0.8mm
Terminal FormBALL
Number of I/O128
HTS Code8542.31.00.01
Length23mm
Width23mm
Operating Temperature-40°C~100°C TJ
Supply Voltage0.85V
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
PeripheralsDMA, WDT
Number of Terminations784
Core ProcessorQuad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
SeriesZynq? UltraScale+? MPSoC EG
RAM Size1.2MB
Height Seated (Max)3.32mm
Package / Case784-BFBGA, FCBGA
Speed500MHz, 1.2GHz
JESD-30 CodeS-PBGA-B784
Primary AttributesZynq?UltraScale+? FPGA, 103K+ Logic Cells
ConnectivityCANbus, I2C, SPI, UART/USART, USB
ArchitectureMPU, FPGA

Manufacturer introduction

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