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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
RoHS StatusRoHS Compliant
ECCN CodeEAR99
Surface MountYES
Part StatusObsolete
PackagingTray
Qualification StatusNot Qualified
Height Seated (Max)2.54mm
TechnologyCMOS
Time@Peak Reflow Temperature-Max (s)30
Published2010
Reach Compliance Codenot_compliant
Terminal Pitch1mm
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal FormBALL
JESD-609 Codee1
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Moisture Sensitivity Level (MSL)4 (72 Hours)
Length23mm
Width23mm
Operating Temperature-40°C~100°C TJ
Number of Terminations484
Peak Reflow Temperature (Cel)250
Number of I/O130
RAM Size256kB
UV ErasableN
ArchitectureMCU, FPGA
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
JESD-30 CodeS-PBGA-B484
Speed667MHz
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
SubcategoryOther uPs/uCs/Peripheral ICs
Package / Case484-BBGA, FCBGA
Power Supplies11.8V
PeripheralsDMA
Primary AttributesKintex?-7 FPGA, 125K Logic Cells
SeriesAutomotive, AEC-Q100, Zynq?-7000 XA

Manufacturer introduction

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