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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
ECCN CodeEAR99
Surface MountYES
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Peak Reflow Temperature (Cel)NOT SPECIFIED
PackagingTray
Factory Lead Time10 Weeks
Qualification StatusNot Qualified
TechnologyCMOS
Published2010
Height Seated (Max)1.6mm
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal Pitch0.8mm
Terminal FormBALL
JESD-609 Codee1
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Moisture Sensitivity Level (MSL)4 (72 Hours)
Data Bus Width32b
Length17mm
Core ArchitectureARM
Operating Temperature-40°C~100°C TJ
Number of I/O130
RAM Size256kB
UV ErasableN
Number of Terminations400
Number of Pins400
ArchitectureMCU, FPGA
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
Frequency667MHz
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
SubcategoryOther uPs/uCs/Peripheral ICs
Power Supplies11.8V
PeripheralsDMA
Package / Case400-LFBGA, CSPBGA
Primary AttributesArtix?-7 FPGA, 28K Logic Cells
SeriesAutomotive, AEC-Q100, Zynq?-7000 XA
InterfaceCAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Manufacturer introduction

*The following five components have specifications similar