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In Stock: 500

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Product Details

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Product Details

*The following are the basic parameters of the product, involving the characteristics of the product and its category

TYPEDESCRIPTION
Part StatusActive
RoHS StatusROHS3 Compliant
MountSurface Mount
ECCN CodeEAR99
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Peak Reflow Temperature (Cel)NOT SPECIFIED
PackagingTray
Factory Lead Time10 Weeks
Qualification StatusNot Qualified
TechnologyCMOS
Moisture Sensitivity Level (MSL)3 (168 Hours)
Published2010
HTS Code8542.39.00.01
Terminal PositionBOTTOM
Terminal Pitch0.8mm
Terminal FormBALL
Operating Supply Voltage1V
JESD-609 Codee1
Height Seated (Max)1.5mm
Operating Temperature-40°C~125°C TJ
Number of I/O86
Number of Terminations225
Number of Pins225
Contact PlatingCopper, Silver, Tin
Length13mm
Data Bus Width32b
Core ArchitectureARM
Terminal FinishTIN SILVER COPPER
RAM Size256kB
UV ErasableN
ArchitectureMCU, FPGA
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
Frequency667MHz
Core ProcessorDual ARM? Cortex?-A9 MPCore? with CoreSight?
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
SubcategoryOther uPs/uCs/Peripheral ICs
Power Supplies11.8V
PeripheralsDMA
Package / Case225-LFBGA, CSPBGA
Primary AttributesArtix?-7 FPGA, 28K Logic Cells
SeriesAutomotive, AEC-Q100, Zynq?-7000 XA
InterfaceCAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Manufacturer introduction

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