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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
RoHS Status | ROHS3 Compliant |
Mounting Type | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
ECCN Code | EAR99 |
Surface Mount | YES |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Memory Width | 8 |
Packaging | Tray |
Published | 2016 |
Qualification Status | Not Qualified |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Interleaved Burst Length | 48 |
Sequential Burst Length | 48 |
Part Status | Discontinued |
Terminal Position | BOTTOM |
Terminal Pitch | 0.8mm |
Memory Interface | Parallel |
Height Seated (Max) | 1.2mm |
Output Characteristics | 3-STATE |
Width | 8mm |
Supply Voltage | 1.5V |
Power Supplies | 1.5V |
Memory Type | Volatile |
Number of Terminations | 78 |
Pin Count | 78 |
Operating Mode | SYNCHRONOUS |
I/O Type | COMMON |
Memory Format | DRAM |
Length | 10.5mm |
Refresh Cycles | 8192 |
Clock Frequency | 800MHz |
Access Time | 20ns |
Voltage – Supply | 1.425V~1.575V |
Additional Feature | AUTO/SELF REFRESH |
Supply Voltage-Max (Vsup) | 1.575V |
Supply Voltage-Min (Vsup) | 1.425V |
Operating Temperature | -40°C~95°C TC |
Technology | SDRAM – DDR3 |
Memory Density | 2147483648 bit |
Package / Case | 78-TFBGA |
Memory Size | 2Gb 256M x 8 |
HTS Code | 8542.32.00.36 |
Organization | 256MX8 |
JESD-30 Code | R-PBGA-B78 |
Supply Current-Max | 0.34mA |
Standby Current-Max | 0.019A |
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